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solder paste
Lead-containing medium-temperature solder paste
XGSP40
35 g/183°C
DIM: 370*280*350 mm
G.W.: 21.4 kg
QTY: 32/576 pcs
DIM: 161*84*95.4 mm
G.W.: 1.16 kg
QTY: 1/32 pcs
XGSP30
20 g/183°C
DIM: 370*280*350 mm
G.W.: 16.9 kg
QTY: 48/768 pcs
DIM: 152*117.4*84.8 mm
G.W.: 1.04 kg
QTY: 1/48 pcs
XGSP50
42 g/183°C
DIM: 370*280*350 mm
G.W.: 24.1 kg
QTY: 20/560 pcs
DIM: 161*68*86 mm
G.W.: 0.90 kg
QTY: 1/20 pcs
XGSP80
60 g/183°C
DIM: 370*270*360 mm
G.W.: 25 kg
QTY: 24/384 pcs
DIM: 152*117.4*84.8 mm
G.W.: 1.52 kg
QTY: 1/24 pcs
XG Z40
35 g/183°C
DIM: 298*229*121 mm
G.W.: 2.05 kg
QTY: 1/50 pcs
Solder paste specially formulated for chip soldering
ZW50
50 g / 183°C
Dimensions: 410 × 410 × 210 mm
Gross Weight: 2.58 kg
Quantity: 1/50 pcs
Dimensions: 195 × 75 × 90 mm
Gross Weight: 1.07 kg
Quantity: 1/20 pcs
ZC50
50 g / 158°C
Dimensions: 410 × 410 × 210 mm
Gross Weight: 21.7 kg
Quantity: 20/400 pcs
Dimensions: 195 × 75 × 90 mm
Gross Weight: 1.06 kg
Quantity: 1/20
LW50
50 g / 138°C
Dimensions: 410 × 410 × 210 mm
Gross Weight: 21.7 kg
Quantity: 20/400 pcs
Dimensions: 195 × 75 × 90 mm
Gross Weight: 1.05 kg
Quantity: 1/20 pcs
GW50
50 g / 217°C
Dimensions: 410 × 410 × 210 mm
Gross Weight: 21.7 kg
Quantity: 20/400 pcs
Dimensions: 195 × 75 × 90 mm
Gross Weight: 1.05 kg
Quantity: 1/20 pcs
Lead-free, mid-temperature solder paste
XGS35
35 g / 158°C
DIM: 370*280*350 mm
QTY: 32/768 pcs
DIM: 161*84*95.4 mm
G.W.: 1.20 kg
QTY: 1/32 pcs
XGS20
20 g / 158°C
DIM: 370*280*350 mm
G.W.: 26.2 kg
QTY: 48/768 pcs
DIM: 152*117.4*84 mm
G.W.: 1.05 kg
QTY: 1/48 pcs
XGS60
60 g / 158°C
DIM: 370*280*350 mm
G.W.: 23.9 kg
QTY: 24/384 pcs
DIM: 152*117.4*84.8 mm
G.W.: 1.52 kg
QTY: 1/24 pcs
XGS40
42 g / 158°C
DIM: 370*280*350 mm
G.W.: 24.1 kg
QTY: 20/560 pcs
DIM: 161*68*86 mm
G.W.: 0.90 kg
QTY: 1/20 pcs
Lead-free high-temperature solder paste
V3S35
DIM: 360*270*370MM
G.W.: 16.9KG
QTY: 48/720PCS
DIM: 152*117.4*84.8mm
G.W.: 1.04KG
QTY: 1/48PCS
V4S35
DIM: 500*500*430MM
G.W.: 21.5KG
QTY: 40/480PCS
DIM: 85*180MM
G.W.: 1.71KG
QTY: 1/40PCS
V4S38
DIM: 370*280*350MM
G.W.: 21.4KG
QTY: 32/576PCS DIM: 161*84*95.4MM G.W.: 1.16KG
QTY: 1/32PCS
V5S35
DIM: 370*280*350MM
G.W.: 24.1KG
QTY: 20/560PCS
DIM: 161*68*86MM
G.W.: 0.89KG
QTY: 1/20PCS
V8S35
DIM: 370*280*350MM
G.W.: 23.9KG
QTY: 24/384PCS
DIM: 152*117.4*84.8MM
G.W.: 1.518KG
QTY: 1/24PCS
906SAC305
DIM: 370*280*350MM
G.W.: 21.0KG
QTY: 20/40PCS
MCN-0307
DIM: 370*280*350MM
G.W.: 21.0KG
QTY: 20/40PCS
Lead-free low-temperature solder paste
V3B45
20G/138℃
DIM: 370*280*350MM
G.W: 16.9KG
QTY: 48/768PCS
DIM: 152*117.4*84.8MM
G.W: 1.04KG
QTY: 1/48PCS
V4B48
35G/138℃
DIM: 370*280*350MM
G.W: 21.4KG
QTY: 32/576PCS
DIM: 161*84*95.4mm
G.W: 1.15KG
QTY: 1/32PCS
V5B45
42G/138℃
DIM: 370*270*370MM
G.W: 26.2KG
QTY: 20/560PCS
DIM: 161*84*95.4mm
G.W: 0.9KG
QTY: 1/20PCS
V8B45
60G/138℃
DIM: 370*280*350MM
G.W: 1.51KG
QTY: 1/24PCS
MCN-4258
500G/138℃
DIM: 325*265*200MM
QTY: 1/20PCS
V4B45
40G/138℃
DIM: 298*229*121MM
G.W: 1.71KG
QTY: 1/40PCS
Solder paste specially formulated for CPU reballing on Android devices
GW50
50 g / 217°C
Dimensions: 410 × 410 × 210 mm
Gross Weight: 21.7 kg
Quantity: 20/400 pcs
Dimensions: 195 × 75 × 90 mm
Gross Weight: 1.05 kg
Quantity: 1/20 pcs
CPG90 Beta
50 g / 199°C
Dimensions: 410 × 410 × 210 mm
Quantity: 20/400 pcs
Gross Weight: 21.90 kg
Dimensions: 195 × 75 × 90 mm
Gross Weight: 1.06 kg
Quantity: 1/20 pcs
CPG90 Beta
35 g / 199°C
Dimensions: 298 × 229 × 121 mm
Quantity: 1/50 pcs
Gross Weight: 2.19 kg
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